Internet of Things has emerged as a last-mile solution for connecting various cyber technologies to our daily life. It provides a platform for integrating and analyzing the distributed Things, Data, and Services. The open issues include sensors and smart objects, resource-constrained devices and networks, real-time IoT OS systems, secure and robust communications, data collection and analysis, network graph embedding, machine learning and other analytics, IoT big data, mobile services, service composition, object discovery, behavior classification and prediction. This workshop aims to provide a forum for researchers to present thoughts and results for the most recent advances in different aspects of IoT and Future Communication Technologies. Topics of interest include, but not limited to:
Future Generation Communication Networks
Wireless Sensor Networks
5G, 4G, LTE, LTE-Advanced
Intelligent Internet Communication
IoT Architectures, Systems
Networking Technologies for IoT
Protocols and Algorithms for IoT
Information Management and IoT
Data Analytics for IoT
Security and Privacy of IoT
Smart Homes and Smart Cities
Industrial IoT Applications
Medical applications for IoT
E-commerce and IoT
Artificial Intelligence and IoT
Health-care and IoT
Fog Computing and IoT
Cloud Computing and IoT
Authors are invited to submit original technical papers via http://edas.info/N24730 or login to http://edas.info/ by selecting “2018 IoT”.
Electronic submission to email@example.com with title of “IoT 2018 Submission” is also accepted. Please DO NOT submit in both ways.
All submitted manuscripts should be prepared as technical papers and may not exceed 8 letter size (8.5 x 11) pages including figures, tables and references using the IEEE format for conference proceedings (print area of 6-1/2 inches (16.51 cm) wide by 8-7/8 inches (22.51 cm) high, two-column format with columns 3-1/16 inches (7.85 cm) wide with a 3/8 inch (0.81 cm) space between them, single-spaced 10-point Times fully justified text). For more information please see
. Submissions not conforming to these guidelines may be returned without review. The submitted manuscripts can be prepared in Word, or Latex using the IEEE templates, but authors should finally submit the manuscript in PDF format and make sure that the file will print on a printer that uses letter size (8.5 x 11) paper. The official language of the meeting is English.
Manuscript submission procedure is available over the Web at
. We encourage you to use EDAS online submission by selecting “2018 Cybersecurity”. If you have troubles in using the Web submission, you can also submit your paper to
or contact us. Electronic submissions must be in the form of a readable PDF file.
Submitted manuscripts have to present the original unpublished research that is not currently under review for any other conference or journal. Papers not following these guidelines will be rejected without review and further action may be taken, including (but not limited to) notifications sent to the heads of the institutions of the authors and sponsors of the conference. Submissions received after the due date, exceeding length limit, or not appropriately structured may also not be considered.
Manuscripts should present the current research in the areas identified in the call for papers. All submitted manuscripts will be reviewed by experts in the fields and will be judged from the aspects of problem significance, contributions, originality, correctness, technical strength, quality of presentation, and relevance to the conference attendees. Papers will be accepted with Regular Papers and Short Papers with maximal 8 pages and 4 pages in the final version respectively.
All accepted and presented papers will be published in CyberC 2018 Proceeding by IEEE Computer Society Conference Publishing Services. These papers will be collected in
and further scheduled to EI, Dblp, Google Scholars, SCOPUS, and other IEEE abstract and index partners (e.g., INSPEC, Thomson Reuters’ Web of Science). You can find our all publications recorded in the past 9 years.