Smart Sensor Networks 2018

Smart sensor networks are taking an important role that serve as the interfaces for the Internet of Things (IoT) systems to monitor and interact with the physical world. The aim of this workshop is to gather latest research breakthroughs in the area of sensor networks development, especially for its applications in smart cities, power distribution systems, intelligent public transport services, pervasive health technologies, and social networks. This workshop will provide a forum for presenting and discussing the most recent advances in different aspects of smart sensor networks. The workshop aims to gather leading researchers from academics and industry to present their research achievements and share their experiences in developing and deploying sensor networks. Topics of interest include, but not limited to:

    Enabling Technologies for Smart Cities
    Internet of Things (IoT)
    Sensor-aided Smart Grids
    Vehicular Sensor Networks
    Video Sensor Networks
    Sensor-aided Social Networks
    Cognitive Radio Sensor Networks
    Robot-aided sensor networks
    Body Sensor Networks
    Sensor-Cloud Applications
    Data Fusion in Smart Sensor Networks
    Big Data in Sensory Systems
    Human-Sensor Interactions
    Bio-Inspired Sensor Networks
    Resource Management
    Cross-Layer Design and Optimization
    Network Security

Workshop Chair

Chi-Tsun (Ben) Cheng - The Hong Kong Polytechnic University, Hong Kong

Workshop Co-Chairs

Donglin Wang - New York Institute of Technology, USA

Hongbin Chen - Guilin University of Electronic Technology, China

Qingfeng Zhou - Hefei University of Technology, China

ZhiQiang (Michael) Chen - Nanjing University of Science and Technology, China

Workshop Co-Chairs

Donglin Wang - New York Institute of Technology, USA

Hongbin Chen - Guilin University of Electronic Technology, China

Qingfeng Zhou - Hefei University of Technology, China

ZhiQiang (Michael) Chen - Nanjing University of Science and Technology, China

Technical Program Committee Members

Achintha Maddumabandara - Shaw Communications, Canada

Chatura Seneviratne - University of Ruhuna, Sri Lanka

Gayan Attanayake - AnsaldoSTS, Australia

Haruna Matsushita - Kagawa University, Japan

Han Zhang - South China Normal University, China

Homin Kwon - SYSTRAN Software Inc., USA

Jing (Vicky) Wang - The Hong Kong Polytechnic University, Hong Kong

Kai-Yin (Kenny) Fok - The Hong Kong Polytechnic University, Hong Kong

Kia Fallahi - Eaton, Canada

Lusheng Wang - Hefei University of Technology, China

Nuwan Ganganath - The University of Western Australia, Australia

Prabhath Ilangakoon - Ceylon Electricity Board, Sri Lanka

Qingquan Sun, Oakland University, USA

Shengli Zhang - Shenzhen University, China

Shintaro Arai - Okayama University of Science, Japan

Sumona Mukhopadhyay - University of Calgary, Canada

Thilina Yapa Bandara - Zone24x7 (pvt) Ltd., Sri Lanka

Wang-Hei Ho - The Hong Kong Polytechnic University, Hong Kong

Wanmai Yuan - Harbin Institute of Technology, China

Xi Chen - Global Energy Interconnection Research Institute North America (GEIRINA), USA

Xiaofan Liu - Southeast University, China

Xinzhi Xu - Global Energy Interconnection Development and Cooperation Organization, China

Yoko Uwate - Tokushima University, Japan

Zhizhong Ding - Hefei University of Technology, China

Zhuo Chen - ICT Center, CSIRO, Sydney


Authors are invited to submit original technical papers via or login to by selecting “2018-IWSSN”.


Electronic submission to with title of “2018-IWSSN Submission” is also accepted. Please DO NOT submit in both ways.

Manuscript Guidelines:

All submitted manuscripts should be prepared as technical papers and may not exceed 8 letter size (8.5 x 11) pages including figures, tables and references using the IEEE format for conference proceedings (print area of 6-1/2 inches (16.51 cm) wide by 8-7/8 inches (22.51 cm) high, two-column format with columns 3-1/16 inches (7.85 cm) wide with a 3/8 inch (0.81 cm) space between them, single-spaced 10-point Times fully justified text). For more information please see . Submissions not conforming to these guidelines may be returned without review. The submitted manuscripts can be prepared in Word, or Latex using the IEEE templates, but authors should finally submit the manuscript in PDF format and make sure that the file will print on a printer that uses letter size (8.5 x 11) paper. The official language of the meeting is English.

Manuscript submission procedure is available over the Web at . We encourage you to use EDAS online submission by selecting “2018 Cybersecurity”. If you have troubles in using the Web submission, you can also submit your paper to or contact us. Electronic submissions must be in the form of a readable PDF file.

Submitted manuscripts have to present the original unpublished research that is not currently under review for any other conference or journal. Papers not following these guidelines will be rejected without review and further action may be taken, including (but not limited to) notifications sent to the heads of the institutions of the authors and sponsors of the conference. Submissions received after the due date, exceeding length limit, or not appropriately structured may also not be considered.

Paper Acceptance:

Manuscripts should present the current research in the areas identified in the call for papers. All submitted manuscripts will be reviewed by experts in the fields and will be judged from the aspects of problem significance, contributions, originality, correctness, technical strength, quality of presentation, and relevance to the conference attendees. Papers will be accepted with Regular Papers and Short Papers with maximal 8 pages and 4 pages in the final version respectively.


All accepted and presented papers will be published in CyberC 2018 Proceeding by IEEE Computer Society Conference Publishing Services. These papers will be collected in IEEE Xplore and further scheduled to EI, Dblp, Google Scholars, SCOPUS, and other IEEE abstract and index partners (e.g., INSPEC, Thomson Reuters’ Web of Science). You can find our all publications recorded in the past 9 years.